How to Prepare a Custom IC Packaging RFQ for Supplier Review
Introduction: A custom IC packaging RFQ becomes a workable engineering review when design intent, package geometry, ball pitch, pin arrangement, and assembly limits arrive together. A fabless team often reaches this stage with a working die, a draft ball map, and a launch schedule that leaves little room for clarification. Whether the response becomes a usable quotation path or a round of questions depends on the first message. A semiconductor packaging manufacturer needs enough design intent to judge substrate routing, layer count, power delivery, thermal load, and board assembly compatibility. Why the RFQ Starts with Design Intent and Package Geometry Design intent describes what the chip must do: I/O count, current through the substrate, junction temperature under load, and whether the part lands on a socketed server board or a soldered module. Package geometry is the physical envelope those requirements must fit: body size, thickness, ball or pin count, and the pitch your board c...